Adhesive Formulation: Specialized solvent acrylic

Carrier: None (Unsupported Transfer Tape)

Conductivity Type: Anisotropic (Z-Axis only)

180-Degree Peel Strength: 25 oz/in (6.9 N/25mm)

Shear Adhesion: Holds >24 hours under a 2.2 psi load

Minimum Application Temperature: -40°F (-40°C)

Maximum Continuous Use
Temperature: 250°F (121°C)

Overview: This is an unsupported solvent acrylic transfer tape that conducts electrical current strictly through its thickness (Z-axis). This anisotropic property guarantees optimal grounding while completely preventing unwanted lateral short circuits between adjacent circuit traces. Engineered to facilitate highly efficient energy transfer, it features extremely low electrical resistance, making it vital for sensitive microelectronics requiring instantaneous grounding and superior signal clarity.

Physical Characteristics: Because it lacks a rigid central carrier film, the adhesive offers extreme physical flexibility and exceptional conformability. It easily adapts to highly irregular geometries, tight radii, and heavily textured substrates.

Applications:

EMI/RFI Shield Attachment: Mounting electromagnetic and radio frequency interference shields to metal housings in smartphones, computers, and networking routers.

Conductive Gasket Mounting: Securely anchoring conductive gaskets within device enclosures for structural sealing and electrical grounding.

ESD Pad Installation: Attaching electrostatic discharge pads in consumer electronics to protect microprocessors and PCBs from static damage.

Flexible Circuit Splicing: Seamlessly splicing and attaching flexible printed circuits (FPCs) without high-heat soldering, preventing thermal damage.

Wearable Technology Integration: Bonding smartwatches and medical monitoring patches that undergo continuous bending, twisting, and movement.

Automotive Electronics: Grounding infotainment systems, navigation displays, and sensor modules subject to severe vibrations.